Featured Product
IC Diamond ® Thermal Compound
IC Diamond is truly an outstanding thermal product with the combined attributes of ultra-high performance and high durability. IC Diamond lasts 3X-4X longer than your typical retail compound. On independent tests and reviews by over 900 over clockers on 24 websites, IC Diamond out performed all previously installed user compounds.
Eleven PC Hardware sites conducted competitive comparisons of thermal compound performance. All comparisons highlight IC Diamond thermal paste’s top tier performance characteristics
Applications
- IC Packaging Heat Conduction
- Battery Thermal Management
- LED Lighting Thermal Management
- Heatsink-Thermal Interface-Non Bonding
Innovation Cooling provides custom repackaging services for our commercial customers – Inquire here
Data Sheet
IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heat sink by taking advantage of diamond’s superior thermal conductivity.
Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond’s five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
Key Features
Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 92% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
- Superior bulk conductivity
- Excellent thermal impedance
- Tight particle distributions
- < 40 µ maximum particle diameter
- Silicone free
- Lower viscosity
- Greater stability
- Non capacitive or electrically conductive
Curing Time: IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use. *
Stability: IC Diamond is designed for stability – it will not bleed or separate in normal use.
Key Specifications
Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D – 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 µ BLT
Average Particle Size: <40 µ maximum particle diameter
Compliancy: RoHS Compliant.
Note* Cure Time Assumes an optimized pressure of 50 PSI Lighter load pressures will increase cure times to a week or more
IC DIAMOND THERMAL COMPOUND
Precautionary Information
Refer to Product Label and Material Safety Data Sheet for Health and Safety Information before using this product.
For Additional Information
To request additional product information or to arrange for sales assistance, call Innovation Cooling Service at 203 732 5312. Address correspondence to: Innovation Cooling, 350 East Main Street, Ansonia CT.
Important Notice
The statements and technical information contained herein are based on tests and data which Innovation Cooling believes to be reliable, but the accuracy or completeness of such statements and technical information is not guaranteed. User is responsible for determining whether a specific Innovation Cooling product is fit for a particular purpose and suitable for user’s method of application. Please remember that many factors can affect the use and performance of an Innovation Cooling product in a particular application. The materials to be bonded with the product, the surface preparation of those materials, the product selected for use, the conditions in which the product is used, and the time and environmental conditions in which the product is expected to perform are among the many factors that can affect the use and performance of an Innovation Cooling product.
Given the variety of factors that can affect the use and performance of an Innovation Cooling product, some of which are uniquely within the user’s knowledge and control, it is essential that the user evaluate the Innovation Cooling product to determine whether it is fit for a particular purpose and suitable for the user’s method of application.
No Warranty
INNOVATION COOLING LLC MAKES NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Limitation of Remedies And Liability
If the Innovation Cooling product is proved to be defective, THE EXCLUSIVE REMEDY, AT Innovation Cooling’s OPTION, SHALL BE TO REFUND THE PURCHASE PRICE OF THE DEFECTIVE Innovation Cooling product. Innovation Cooling shall not otherwise be liable for loss or damages, whether direct, indirect, special, incidental, or consequential, regardless of the legal theory asserted, including, but not limited to, contract, negligence, warranty, or strict liability.
Available in unlimited quantities. Purchase IC Thermal Compound Direct.