IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity.
Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 92% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
Superior bulk conductivity
Excellent thermal impedance
Tight particle distributions
< 40 µ maximum particle diameter
Non capacitive or electrically conductive
Curing Time: IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use. *
Stability: IC Diamond is designed for stability - it will not bleed or separate in normal use.
Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D - 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 µ BLT
Average Particle Size: <40 µ maximum particle diameter
Compliancy: RoHS Compliant.
Note* Cure Time Assumes an optimized pressure of 50 PSI Lighter load pressures will increase cure times to a week or more
IC DIAMOND THERMAL COMPOUND
Refer to Product Label and Material Safety Data Sheet for Health and Safety Information before using this product.
For Additional Information
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