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Independent User Thermal
Testing 702 Independent users in 20 different forums used their own PCs to test
the difference between IC Diamond and other thermal compounds. This
independent testing shows an average performance gain of 3.74 ºC over other thermal compounds |
Pressure
and Contact
Testing
As a continuation of work to
better understand the dynamics impacting thermal grease
performance, tests were conducted by users in four different forums using contact
pressure film from Sensor
Products to evaluate thermal
performance as it relates to contact and pressure |
Application
Instructions
IC
Diamond has undergone considerable user testing combined with Innovation Cooling's own studies to optimize
performance along with ease of application. It is highly recommended
that you use our procedure and no others for best results
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IC Diamond
Reliability
IC Diamond was
originally designed as a high reliability T1 compound for use between the IHS and CPU. IC Diamond is highly bulk
loaded with over 92% micronized diamond particles to limit pump out due to
thermal cycling.
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